• Foundry
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  • Package
    •  Turnkey
  • Solution
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  • Product
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  • Equipment
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    Package

    Package Service

  • Rootsemicon offers the wide ranges of package portfolios in the industry plus. we provide a full range of turnkey test services for RF, mixed-signal, analog, digital and power devices.

    Rootsemicon also offers Lead Frame base PKG (QFN, DFN, QFP, LQFP, SOP, DIP, Power PKG), SiP (System in Package), WLCSP and Image sensor PKG.

    • Package Lineup

    QFP QFP LQFP TQFP E-Pad

    QFN DFN QFN DFN Sensor-DFN Multi-chip QFN

    SOP SOP SSOP TSOP TSSOP

    BGA LGA WLCSP BGA Flip-chip Mems-LGA Finger-Print

    Open-Cavity COB COF COB COF MicroSD